| 年度 | 2013 |
|---|---|
| 全部作者 | Jen-Ching Huang , Wei-Piao Wu , Zhi-Wei Du , Kun-Ling Wu and Feng -Chin Tsai |
| 論文名稱 | The Study on the Large-area Flat Plane by Using Electro-rheological Fluid Polishing |
| 會議名稱 | 16th INTERNATIONAL CONFERENCE ON ADVANCES IN MATERIALS & PROCESSING TECHNOLOGIES |
| 地點 | 台灣Taiwan - Taipei, Taiwan |
| 著作人數 | 4 |
| 檔案 |